Edge Intelligence in the Consumer Era: Bringing AI, IoT and 5G...
The consumer electronics industry is entering a phase where connectivity alone is no longer enough. Devices are becoming increasingly capable of processing information, understanding...
Daily News & Analysis
Applied Materials and Intel Join Forces to Advance AI Chipmaking
Applied Materials, the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations...
Edge Intelligence in the Consumer Era: Bringing AI, IoT and 5G...
The consumer electronics industry is entering a phase where connectivity alone is no longer enough. Devices are becoming increasingly capable of processing information, understanding...
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Automotive
Wireless & Networking
Hikvision India Showcases WonderOS 4.0-IDP and Latest PRO AV Solutions at...
Hikvision India showcased WonderOS 4.0 Operating System along with the latest Interactive Display Panels (IDP), Active LED, Digital Signage and Pro AV Solutions at...
Display Module a Complete Guide to Modern Display Technology
What is a Display Module?
A display module is a fully integrated electronic unit designed to present visual information such as text, graphics, images, videos,...
5 BESS and Power Conversion Products Supporting India’s Renewable Energy Expansion
As India works towards expanding its non-fossil fuel power capacity, the challenge is increasingly moving beyond renewable generation alone. Greater penetration of solar and...
BESS Emerge as Key Enabler of India’s Energy and Mobility Transition
Battery Energy Storage Systems (BESS) are vital to India’s clean energy transition, stabilizing the grid to achieve 500 GW of renewable capacity by 2030–31....
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How AI and Edge Computing Are Transforming Digital Examinations
In an interview, Adarsh Sudhindra, Chief Innovation Officer, Excelsoft Technologies Limited, spoke with TimesTech, about how Saras is redefining digital assessment infrastructure for low-connectivity...
AI to Reshape Engineering as Simulation Moves Beyond Validation
In an interview with TimesTech, Bob Jones, Chief Revenue Officer at Siemens DISW, discusses how AI, simulation and connected data are reshaping engineering workflows....
Natarajan Laxsmanan on Building AI-First Enterprises and Trusted CX
In an interview, Natarajan Laxsmanan, CEO, Alldigi, with TimesTech, discusses what it takes to build truly AI-first organisations beyond isolated AI deployments. He explores...
Supertron Bets on Value-Added Distribution to Drive Tech Growth
In an interview with TimesTech, Mr. Debraj Dam, Chief - Supertron Value Added Distribution, discusses the evolving role of technology distributors amid India’s expanding...
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IMC 2026 Global Leaders Advance AI, Telecom Cyber Defence and Digital Trust
The 10th edition of India Mobile Congress (IMC) 2026 brought global consensus and sovereign innovation to the forefront, anchoring the forum's focus on next-generation...
Lekha Wireless Enhances its Mobile Wireless Network Product Portfolio with ADI Technology
Lekha Wireless Solutions Private Limited, a leader in indigenous mobile wireless communication equipment, announced the integration of Analog Devices, (ADI) radio technology into its...
Global Leaders at IMC 2026 Say AI-Native Networks and 6G Will Define What Comes...
As the 10th edition of India Mobile Congress (IMC) 2026 gathers pace at Yashobhoomi, the forum is setting the tone for the rest of...
IMC 2026 Opens with Focus on 6G, Satellite Convergence and AI Networks
Building on a landmark inaugural session, the 10th edition of India Mobile Congress (IMC) 2026 gathered global industry leaders, policymakers, telecom operators and academia,...
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pSemi Announces Two UltraCMOS+ Front-End Modules for 2.4 GHz IoT Connectivity
pSemi Corporation, a Murata company leading in the design and development of semiconductor integration and advanced connectivity, announced the PE566212 and PE566213, two fully...
Silicon Labs Expands AI Developer Platform to Simplify IoT Development and Scale Edge Intelligence
Silicon Labs, the leading innovator in low-power wireless connectivity, announced a set of developer initiatives that makes it easier to build, extend, and operate...
RF Backscatter IoT in Healthcare: Can Medical Sensors Communicate Without a Radio Transmitter?
Most wireless medical devices need a radio transmitter to send sensor data. That transmitter requires power, which becomes a challenge when the device is...
ESSCI, NIELIT ink MoU to boost semiconductor, AI, IoT and drone skilling
In a move aimed at creating a job-ready talent pool for India’s fast-growing electronics and emerging technology sectors, the Electronics Sector Skills Council of...
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TI Unveils ADC for Nanosecond-Level Telemetry in AI Data Centers
At the Open Compute Project (OCP) Global Summit, Texas Instruments debuted the first analog-to-digital converter (ADC) to enable 24/7, low-power, event-based remote monitoring at...
India’s AI Data Center Boom Driven by GPUs and Advanced Cooling
Artificial intelligence (AI) is transforming industries ranging from financial services and healthcare to manufacturing, automotive technology and telecommunications. Behind this transformation is a critical...
Microchip Expands Data Center Portfolio to Meet Evolving AI Infrastructure Demands
As AI workloads drive demand for more scalable and flexible data center architectures, organizations are looking for faster, more efficient ways to move, store...
Data Center Cooling Market to Reach $106.72 Billion by 2035 as AI Drives Liquid...
AI Is Turning Data Center Cooling Into a Strategic Infrastructure Priority
The artificial intelligence boom is creating an infrastructure challenge that cannot be solved by...





















































































